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Product Details:
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Applications: high-power semiconductor module; Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit. Intelligent power module; High frequency switching power supply, solid state relay. Automotive electronics, aerospace and military electronics components. Solar panel components; Telecommunications private exchange, receiving system; Laser and other industrial electronics. . Ceramic substrate features:
1. High thermal conductivity to meet device heat dissipation requirements;
2. Good heat resistance, meet the power device high temperature (more than 200℃) application requirements;
3. Match the thermal expansion coefficient, match the thermal expansion coefficient of the chip material, reduce the thermal stress of the package;
4. Small dielectric constant, good high-frequency characteristics, reduce the device signal transmission time, improve the signal transmission rate;
5. High mechanical strength to meet the requirements of mechanical properties in the process of device packaging and application;
6. Good corrosion resistance, able to withstand strong acid, strong alkali, boiling water, organic solution and other erosion;
7. Compact structure to meet the requirements of electronic device airtight packaging
